80*77mm Square Sunflower Aluminum Extrusion Heatsink for Intel LGA 1155

Product Details
Customization: Available
Application: Computer Accessories & Electronic Components
Type: Heat Sink
Manufacturer/Factory & Trading Company
Gold Member Since 2012

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Number of Employees
257
Management System Certification
ISO9001:2015, IATF16949
  • 80*77mm Square Sunflower Aluminum Extrusion Heatsink for Intel LGA 1155
  • 80*77mm Square Sunflower Aluminum Extrusion Heatsink for Intel LGA 1155
  • 80*77mm Square Sunflower Aluminum Extrusion Heatsink for Intel LGA 1155
  • 80*77mm Square Sunflower Aluminum Extrusion Heatsink for Intel LGA 1155
  • 80*77mm Square Sunflower Aluminum Extrusion Heatsink for Intel LGA 1155
  • 80*77mm Square Sunflower Aluminum Extrusion Heatsink for Intel LGA 1155
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  • Overview
  • Product Description
  • Our Services
  • Packaging & Shipping
  • Company Profile
Overview

Basic Info.

Model NO.
HS-D253
Heatsink Material
Copper & Aluminum
CPU Type
Intel
Size
80*77mm
Color
Black
Transport Package
Standard Export Package
Specification
ROHS
Trademark
Coolwhist
Origin
Guangdong, China (Mainland)
HS Code
8473309000
Production Capacity
80000PCS/Month

Product Description


Product Description

1. Type: aluminum extrusion products 
2. Dimensions can be customized
3. Material: AL6063
4. Surface treatment: anodizing
5. Application: Medical / Communication / Automotive Electronics equipment, Home Appliances...
6. RoHS Directive-compliant
7. ISO 9001: 2008 & TS16949 management system
8. High-Tech Enterprise
9. Inspection machines CMM, projector to assure the quality requirements
10. Thermal simulation and prototyping services
11. OEM/ODM orders are welcome
 

80*77mm Square Sunflower Aluminum Extrusion Heatsink for Intel LGA 1155
80*77mm Square Sunflower Aluminum Extrusion Heatsink for Intel LGA 1155
 
Our Services

 

Product type 1. extruded heat sink
2. heat pipe heat sink
3. skiving fin heat sink
4. stamping heat sink
5. die casting heat sink
6. precision CNC machining heat sink
7. forging heat sink
8. heat pipe
9. cooling fan: DC computer case fan, AC fan, EC fan
Process extrusion, skiving fin, stamping, die casting, precision CNC machining, drilling, milling, bending, soldering, etc
Surface finish anodizing, electrophoresis, nickel plating, sandblasting, power plating, wire drawing, polishing, anti-oxidation coating, etc.
Application 1. Computer fileds: computer mainboard, PC, IPC, Server, PCTV, Router, Power supply  (CPU cooler, VGA cooler, Cooling fan)
2. Home appliances: pico projector, electronic refrigerator, red wine cooler, LASER TV, LCD TV, LED panel, Sound, Air condition, induction cooker, etc.
3. LED lighting: stage light, high bay light, down light, street light,  automobile lamp ,etc.
4. Security fields: security cameras, infrared light cameras.
5. Machines: Industry/Medical machines
 
Packaging & Shipping

 


Delivery
20-25 days after confirming all inforamtions
Packaging Standard export package, we can also accept other requirments from clients.
Shipping 1.The sample will be shipped by express, like FEDEX, DHL, UPS and EMS.
 And the freight should  be paid by clients. 
2. FOB Shenzhen or HongKong for mass production.
the freight will deal with you for the concrete condition
Payment 1.T/T and L/C,Paypal
2.high value sample will be charged, and will be returned to you after 
confirming the mass production.
3.low value sample is free, but the freight should be covered by you  
Company Profile
 
80*77mm Square Sunflower Aluminum Extrusion Heatsink for Intel LGA 1155
80*77mm Square Sunflower Aluminum Extrusion Heatsink for Intel LGA 1155
80*77mm Square Sunflower Aluminum Extrusion Heatsink for Intel LGA 1155
80*77mm Square Sunflower Aluminum Extrusion Heatsink for Intel LGA 1155
80*77mm Square Sunflower Aluminum Extrusion Heatsink for Intel LGA 1155
80*77mm Square Sunflower Aluminum Extrusion Heatsink for Intel LGA 1155
80*77mm Square Sunflower Aluminum Extrusion Heatsink for Intel LGA 1155
80*77mm Square Sunflower Aluminum Extrusion Heatsink for Intel LGA 1155

 

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